SYSTEMS HAVING HEATED VALVE MANIFOLD ASSEMBLIES, METHODS OF MANUFACTURE OF SAME
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United States of America Patent
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Issued Date -
Sep 14, 2023
app pub date -
Sep 28, 2020
filing date -
Sep 28, 2020
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Abstract
A system for semiconductor fabrication having at least one heated valve manifold assembly comprising a heat-conductive plate having a total surface area, said conductive plate having a first side and a second side; at least one heater contacting said at least one heat-conductive plate; a valve manifold comprising a plurality of valves and pipes; said plurality of said valves and pipes having a total surface area wherein a portion of the surface area of said plurality of valves and pipes contacts said at least one heat-conductive plate; and one or more layers of insulation covering: (i) a majority of the surface area of said plurality of said valves and pipes where said portion contacts said at least one heat-conductive plate, (ii) said at least one heater in contact with said at least one heat-conductive plate, and (iii) the majority of the surface area of said at least one heat-conductive plate.
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