MICRO-ELECTRONIC DEVICE WITH INSULATED SUBSTRATE, AND ASSOCIATED MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Sep 7, 2023
app pub date -
Jun 15, 2021
filing date -
Jun 19, 2020
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Abstract
A micro-electronic device includes a first electronic component and a second electronic component, and a substrate formed of a first semiconductor material for supporting the components. The first component and the second component each include an active layer formed at least partially from a second semiconductor material different from the first semiconductor material. The device further includes, for each of the components, a stack for maintaining electrical voltage, which stack is situated between the substrate and the active layer of the electronic component under consideration and which comprises two layers forming a junction P-N formed from the same semiconductor material as the substrate and which insulates the relevant active layer from the substrate. The assemblies respectively including the first component and the second component and their respective stack for maintaining electrical voltage are separated from each other by a barrier made of electrically insulating material.
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