FUNGAL MYCELIUM FIBERBOARD AND ITS PREPARATION METHOD
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United States of America Patent
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Issued Date -
Sep 7, 2023
app pub date -
May 12, 2023
filing date -
Jun 24, 2021
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Abstract
A method of preparing fungal mycelium fiberboards is provided. First, 1-2 year-old fungal mycelium with a water content of 50-70% is cut into 2-3 cm lengths to obtain cut fungal mycelium. The cut fungal mycelium is then high-pressure steamed to soften it, resulting in the steamed fungal mycelium. The steamed fungal mycelium is mechanically defiberized into fibers and adhesive is added to obtain adhesive-applied fungal mycelium fibers. The adhesive-applied fungal mycelium fibers are then dried at 120-160° C., resulting in dried fungal mycelium fibers. The dried fungal mycelium fibers are then spread, leveled, and pre-pressed to obtain fungal mycelium fiberboard blanks, which are hot-pressed to form the final fungal mycelium fiberboard. This method uses low-cost, fast-growing fungal mycelium as a raw material, which replaces wood chips. The preparation process is simple and easy to promote. The resulting fungal mycelium fiberboard exhibits excellent performance in various indicators and is also environmentally friendly.
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