METHOD AND DEVICE FOR LIQUID SPRAY SOLDERING AND THE APPLICATION METHOD THEREOF
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United States of America Patent
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Aug 15, 2023
Grant Date -
Sep 7, 2023
app pub date -
Sep 1, 2022
filing date -
Mar 3, 2022
priority date (Note) -
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Abstract
The disclosure relates to the field of spray welding, and involves a method and a device for liquid spray welding, as well as the application method thereof. The method for liquid spray welding specifically comprises the following steps: S1: Solder to be spray-soldered is melted under the protection of an inert gas; S2: Then, the melted solder is spray-soldered while using ultrasonic focusing. The device includes a solder conversion mechanism which consists of a container; the cavity in the container is used for placing the solder; a spraying hole is arranged at the bottom of the container to connect with the cavity, and a heating mechanism is mounted along the outer wall of the container; a device for driving the solder spraying is used to control the frequency of an ultrasonic generating mechanism.
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