PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND METHOD FOR PRODUCING PARAMYLON-BASED RESIN

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230272123A1
SERIAL NO

18136931

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Abstract

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A paramylon-based resin having a weight-average molecular weight of paramylon in a range of 70000 to 140000, and formed by substituting hydrogen atoms of hydroxy groups of a paramylon with a long-chain component being a linear saturated aliphatic acyl group having 14 or more carbon atoms and a short-chain component being an acyl group (acetyl group or/and propionyl group) having 2 or 3 carbon atoms, wherein a degree of substitution with the long-chain component (DSLo) and a degree of substitution with the short-chain component (DSSh) satisfy the following conditional expressions (1) and (2), Izod impact strength is 5.0 kJ/m2 or more, and an MFR (melt flow rate at 210° C. and under a load of 5 kg) is 2 g/10 min or more. To provide a paramylon-based resin excellent in mechanical characteristics and thermoplasticity. 2.2≤DSLo+DSSh≤2.8 (1) 5≤DSSh/DSLo≤25 (2)

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Patent Owner(s)

Patent OwnerAddress
NEC CORPORATION7-1 SHIBA 5-CHOME MINATO-KU TOKYO 1088001 ?1088001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iji, Masatoshi Ibaraki, JP 70 519
Miyamoto, Toshie Tokyo, JP 8 0
SHIMURA, Midori Tokyo, JP 33 139
Tanaka, Shukichi Tokyo, JP 39 100

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