ATOMIC-SMOOTH DEVICE WITH MICROSTRUCTURE, AND METHOD FOR PREPARING SAME
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United States of America Patent
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Aug 31, 2023
app pub date -
Jun 28, 2020
filing date -
Jun 28, 2020
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Abstract
Provided is an atomic-smooth device with a microstructure. The device includes, from the bottom to top, a substrate, a bonding material, a second dielectric layer on the substrate, the microstructure, and a first dielectric layer, where a surface of the first dielectric layer is an atomic-smooth surface. Further provided is a method for preparing an atomic-smooth device with a microstructure to effectively avoid pits or burrs generated when the existing microstructure is machined.
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