ELECTROSTATIC CHUCK MANUFACTURING METHOD, ELECTROSTATIC CHUCK, AND SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Aug 24, 2023
app pub date -
Apr 25, 2023
filing date -
Mar 2, 2020
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Abstract
A method of manufacturing an electrostatic chuck includes: preparing a first ceramic plate having a first hole formed therein; preparing a second ceramic plate having a second hole formed at a position different from a position of the first hole in a horizontal direction; forming a first slurry layer on the first ceramic plate or the second ceramic plate with a first slurry, the first slurry layer having a flow path formed therein to connect the first hole and the second hole; stacking the first ceramic plate and the second ceramic plate one above the other via the first slurry layer; and bonding the first ceramic plate and the second ceramic plate stacked one above the other via the first slurry layer.
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