Integrated circuit package with magnet having a channel
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United States of America Patent
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Apr 16, 2024
Grant Date -
Aug 17, 2023
app pub date -
Apr 26, 2023
filing date -
Mar 20, 2012
priority date (Note) -
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Abstract
An integrated circuit package and method of fabrication are described. The integrated circuit package includes a lead frame having a first surface and a second opposing surface and a semiconductor die having a first, active surface in which circuitry is disposed and a second opposing surface attached to the first surface of the lead frame. A magnet attached to the second surface of the lead frame has a non-contiguous central region and at least one channel extending laterally from the central region. An overmold material forms an enclosure surrounding the magnet, semiconductor die, and a portion of the lead frame.
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