ION IMPLANTER AND ION IMPLANTATION METHOD

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United States of America Patent

APP PUB NO 20230260741A1
SERIAL NO

18108429

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Abstract

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The ion implantation method includes (a) moving a wafer adjusted to have a first implantation angle with respect to an ion beam from a beam irradiation range toward a beam non-irradiation range; (b) starting a change of the wafer from the first implantation angle to a second implantation angle while the wafer is moved within the beam non-irradiation range after the wafer having the first implantation angle is moved from the beam irradiation range; (c-1) reversing a movement direction of the wafer at an end of the beam non-irradiation range and moving the wafer toward the beam irradiation range; and (c-2) completing the change of the wafer from the first implantation angle to the second implantation angle while the wafer is moved within the beam non-irradiation range before the wafer is returned to the beam irradiation range.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO LTD1-1 OSAKI 2-CHOME SHINAGAWA-KU TOKYOI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ebisu, Shinji Ehime, JP 3 1
Kudo, Tetsuya Ehime, JP 22 70
Ochi, Akihiro Ehime, JP 11 47

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