CHIP RELIABILITY TEST ASSEMBLY
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United States of America Patent
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Issued Date -
Aug 17, 2023
app pub date -
Jun 9, 2022
filing date -
Feb 14, 2022
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Abstract
The present invention proposes a chip reliability test assembly, which comprises a motherboard and a daughter board. The motherboard is used to support the chips during an aging acceleration process at high temperature. The daughter board is used to measure the electricity of chip after the aging acceleration process. Each chip holder is removable off the motherboard. The daughter board does not go through the aging acceleration process and can be reusable.
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