ELECTRONIC DEVICE INCLUDING OUTER HOUSING PLATED WITH CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREFOR
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United States of America Patent
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Issued Date -
Aug 17, 2023
app pub date -
Apr 20, 2023
filing date -
Oct 20, 2020
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Abstract
The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.
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