SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

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United States of America Patent

APP PUB NO 20230257877A1
SERIAL NO

18163949

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A substrate processing apparatus includes: a processing chamber; a rotary table rotatably provided inside the processing chamber; a stage that is rotatable relative to the rotary table at a position spaced apart from a rotation center of the rotary table; a process gas supplier provided above the rotary table; a separation gas supplier to supply a separation gas to separation regions, each of the separation regions being adjacent to a processing region; and a gas exhauster including exhaust ports communicating with an inside of the processing chamber, wherein the exhaust ports are provided in the processing region between the separation regions and are provided above the rotary table.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HAYASHI, Ibuki Iwate, JP 3 0
HONMA, Manabu Iwate, JP 89 6413
TAGUCHI, Junnosuke Iwate, JP 17 21
TAKEUCHI, Yasushi Iwate, JP 113 1569

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