Device and Method for Laminating a Substrate with a Thermoplastic Film

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United States of America Patent

APP PUB NO 20230256657A1
SERIAL NO

18194815

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to an apparatus (1) for laminating a substrate (12) with a thermoplastic film (11), the apparatus (1) comprising the following: —a laminating unit (2) for laminating the substrate (12) with the thermoplastic film (11), —a feed device (4) for the thermoplastic film (11) to the laminating unit (2), wherein the feed device (4) for the thermoplastic film (11) has devices (14) for heating a first side (16) of the film (11) and devices (15) for cooling a second side (17) of the film (11), as well as a number of controllably driven rollers (10) via which the film (11) is guided past the devices (14) for heating and the devices (15) for cooling, wherein a tension of the film (11) can be regulated via the speed of the driven rollers (10).

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAADUSSELDORF DUESSELDORF NORTH RHINE-WESTPHALIA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ethner, Kai Langenfeld, DE 2 0
Kinzelmann, Hans-Georg Pulheim, DE 41 130

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