Component Carrier and Method of Manufacturing the Same
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United States of America Patent
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Issued Date -
Aug 10, 2023
app pub date -
Apr 17, 2023
filing date -
Apr 10, 2019
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Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a component including a terminal made of a first electrically conductive material and being embedded in the stack, a recess in the stack exposing at least a part of the terminal, an interface structure on the at least partially exposed terminal and an electrically conductive structure on the interface structure made of a second electrically conductive material.
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