Metal Body Formed on a Component Carrier by Additive Manufacturing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20230249252A1
SERIAL NO

18301244

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the carrier body and a metal body directly on the metal surface structure formed by additive manufacturing. The metal body is arranged directly on the metal surface structure without material and layers in between.

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Patent Owner(s)

Patent OwnerAddress
AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFTFABRIKSGASSE 13 LEOBEN 8700

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gavagnin, Marco Leoben, AT 27 47
Silvano, de Sousa Jonathan Wien, AT 22 51

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