HEAT DISSIPATION STRUCTURE, HEAT DISSIPATION COMPONENT AND MOUNTING METHOD THEREFOR, AND FOLDABLE TERMINAL
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United States of America Patent
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Issued Date -
Aug 3, 2023
app pub date -
Aug 10, 2021
filing date -
Aug 14, 2020
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Abstract
Disclosed are a heat dissipation structure, a heat dissipation component and a mounting method thereof, and a foldable terminal device. The heat dissipation structure may include: a plurality of elastic heat conduction units; and at least one layer of heat conduction mesh, the heat conduction mesh includes a plurality of interlaced mesh wires, each two interlaced mesh wires are rotatable relative to each other, and the plurality of mesh wires are interlaced to form gaps in which the elastic heat conduction units are arranged.
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