Device and Method for Laminating a Substrate with a Thermoplastic Film

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United States of America Patent

APP PUB NO 20230241807A1
SERIAL NO

18194839

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Device (1) for laminating a substrate (12) with a thermoplastic film (11), said device (1) having the following: a laminating unit (2) for laminating the substrate (12) with the thermoplastic film (11), a feed device (4) for feeding the thermoplastic film (11) to the laminating unit (2), wherein the feed device (4) for the thermoplastic film (11) has devices (14) for heating a first side (16) of the film (11) and devices (15) for cooling a second side (17) of the film (11), and a device (20) for collecting condensate produced on the cooling devices (15).

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAADUESSELDORF

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ethner, Kai Langenfeld, DE 2 0
Kinzelmann, Hans-Georg Pulheim, DE 41 130

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