MANUFACTURING METHOD OF PACKAGE STRUCTURE OF ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Jul 27, 2023
app pub date -
May 23, 2022
filing date -
Jan 24, 2022
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method of a package structure of an electronic device is provided. The manufacturing method includes the following. First, a carrier plate is provided. The carrier plate includes a composite structure and has a first surface and a second surface opposite to each other. Next, an anti-warpage structure is formed on the first surface of the carrier plate. Then, a redistribution structure is formed on the second surface of the carrier plate. When the package structure manufactured with the manufacturing method of the package structure of the electronic device of the disclosure is applied to the electronic device, reliability and/or electrical properties of the electronic device are enhanced.
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