AUTOMATED OVERLAY REMOVAL DURING WAFER SINGULATION
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United States of America Patent
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Issued Date -
Jul 27, 2023
app pub date -
Jul 29, 2022
filing date -
Jan 24, 2022
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Abstract
In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a second vacuum orifice facing the same direction as the surface. The first and second vacuum orifices are on opposing sides of the blade.
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