MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS
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United States of America Patent
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Issued Date -
Jul 27, 2023
app pub date -
Nov 18, 2022
filing date -
Jan 21, 2022
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Abstract
A member for semiconductor manufacturing apparatus has a ceramic plate, a porous plug, an insulating lid, and pores. The ceramic plate has a wafer placement surface as an upper surface. The porous plug is disposed in a plug insertion hole penetrating the ceramic plate in an up-down direction, and allows a gas to flow. The insulating lid is provided in contact with an upper surface of the porous plug, and exposed to the wafer placement surface. A plurality of pores are provided in the insulating lid, and penetrate the insulating lid in an up-down direction.
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