Mechanical suppression of parasitic plasma in substrate processing chamber

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United States of America Patent

PATENT NO 11862435
APP PUB NO 20230238220A1
SERIAL NO

18129370

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Abstract

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A system includes an electrode. The electrode includes a showerhead having a first stem portion and a head portion. A plurality of dielectric layers is vertically stacked between the electrode and a first surface of a conducting structure. The plurality of dielectric layers includes M dielectric layers arranged adjacent to the head portion and P dielectric portions arranged around the first stem portion. The plurality of dielectric layers defines a first gap between the electrode and one of the plurality of dielectric layers, a second gap between adjacent ones of the plurality of dielectric layers, and a third gap between a last one of the plurality of dielectric layers and the first surface. A number of the plurality of dielectric layers and sizes of the first gap, the second gap, and the third gap are selected to prevent parasitic plasma between the first surface and the electrode.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATIONFREMONT CA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Augustyniak, Edward J Tualatin, US 9 67
Keil, Douglas West Linn, US 50 530
Leeser, Karl Frederick West Linn, US 61 67
Sabri, Mohamed Beaverton, US 34 3012

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