COMPOSITE STRUCTURE, RESIN FILM, AND METHOD OF MANUFACTURING RESIN FILM

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United States of America Patent

APP PUB NO 20230235504A1
SERIAL NO

17869308

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A composite structure, a resin film, and a method of manufacturing the resin film are provided. The composite structure includes a release carrier and a resin film. The release carrier includes a release substrate and a release resin layer that is formed on the release substrate. The release resin layer covers the release substrate at a coverage rate of between 60% and 100%. The resin film is formed on the release carrier. The resin film is bonded to each of the release substrate and the release resin layer.

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Patent Owner(s)

Patent OwnerAddress
G-FUN INDUSTRIAL CORPORATIONTAOYUAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHANG, LI-HSUN Taoyuan City, TW 41 123
CHEN, KUO-CHIN Taoyuan City, TW 112 1295
NIU, CHUN-JEN TAOYUAN CITY, TW 1 0
TSAI, CHIU-HSIUNG TAOYUAN CITY, TW 6 3

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges92210201 - 100501001502002503003504004505005506006507007508008509009501000

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