POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BANDGAP ISOLATION ARRAYS
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United States of America Patent
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Issued Date -
Jul 20, 2023
app pub date -
Jan 19, 2023
filing date -
Jan 19, 2022
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Abstract
Power amplifier systems including power amplifier modules (PAMs) and electromagnetic bandgap (EBG) isolation structures are disclosed. In embodiments, the power amplifier system includes a printed circuit board (PCB) and a PAM mounted to the PCB in an inverted orientation. The PCB has a PCB frontside on which a PAM mount region is provided, and radio frequency (RF) input and output bondpads. The PAM includes a topside input/output interface having RF input and output terminals electrically coupled to the RF input and output pads, respectively. The power amplifier system further includes a first EBG isolation structure containing a first grounded EBG cell array, at least a portion of which is located within or beneath the PAM mount region.
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