SEMICONDUCTOR FABRICATION FACILITY
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United States of America Patent
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Issued Date -
Jul 20, 2023
app pub date -
Aug 24, 2022
filing date -
Jan 20, 2022
priority date (Note) -
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Abstract
A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.
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