PHENOLIC RESIN FOAM LAMINATE BOARD AND COMPOSITE BOARD

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United States of America Patent

APP PUB NO 20230226801A1
SERIAL NO

17758897

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In the phenolic resin foam laminate board (10), a surface material (2) is arranged on at least one of one side of a phenolic resin foam (1) and the back side of the one side. The phenolic resin foam (1) has a density of not less than 22 kg/m3 and not more than 50 kg/m3, a cell diameter of not less than 50 μm and not more than 170 μm, and a closed cell ratio of not less than 80%. When HCFO-1224yd(Z), aliphatic hydrocarbons having a carbon number of 6 or less, chlorinated saturated hydrocarbons having a carbon number of 5 or less, and hydrofluoroolefin are gas components, the phenolic resin foam contains only HCFO-1224yd (Z) as a gas component. A cell internal pressure of air bubble is 0.20 atm or more.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CONSTRUCTION MATERIALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 1018101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HIRAMATSU, Nobuki Chiyoda-ku, Tokyo, JP 51 1125
KURODA, Takayuki Chiyoda-ku, Tokyo, JP 72 985
MIHORI, Hisashi Chiyoda-ku, Tokyo, JP 13 23

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