POLISHING PAD, METHOD FOR MANUFACTURING POLISHING PAD AND POLISHING APPARATUS

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United States of America Patent

APP PUB NO 20230226661A1
SERIAL NO

18152163

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to a polishing pad including a polishing layer. The polishing layer defines a plurality of foaming pores, and a diameter of each of the foaming pores is 1 μm to 10 μm. The present disclosure also relates to a method for manufacturing a polishing pad and a polishing apparatus.

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Patent Owner(s)

Patent OwnerAddress
BESTAC ADVANCED MATERIAL CO LTD5F-2 NO 185 KEWANG RD LONGTAN TOWNSHIP TAOYUAN COUNTY 325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HUANG, CHI CHE KAOHSIUNG CITY, TW 1 0
HUNG, HSIEN-CHANG KAOHSIUNG CITY, TW 5 7
HUNG, YUNG-CHANG KAOHSIUNG CITY, TW 45 119
SONG, HSIN-RU KAOHSIUNG CITY, TW 6 0
WANG, LYANG-GUNG KAOHSIUNG CITY, TW 21 42
WU, JENG YI KAOHSIUNG CITY, TW 1 0
YAO, I-PENG KAOHSIUNG CITY, TW 79 189

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