RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
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United States of America Patent
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Issued Date -
Jul 13, 2023
app pub date -
Mar 8, 2023
filing date -
Nov 13, 2020
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Abstract
A radio frequency module includes a module substrate including major surfaces that face each other; a first base part that is at least partially comprised of a first semiconductor material and in which an electronic circuit is formed; a second base part that is at least partially comprised of a second semiconductor material having a thermal conductivity lower than the thermal conductivity of the first semiconductor material and in which an amplifier circuit is formed; and an external connection terminal disposed on or over the major surface. The first base part and the second base part are disposed on or over the major surface out of the major surfaces; and the second base part is disposed between the module substrate and the first base part, is joined to the first base part, and is connected to the major surface via an electrode.
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