METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS
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United States of America Patent
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Issued Date -
Jul 13, 2023
app pub date -
Mar 22, 2023
filing date -
Sep 23, 2020
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Abstract
Provided is a technique of processing a substrate by executing a process recipe including a plurality of steps, the technique including: (a) acquiring vibration data of a member that exhausts an atmosphere in a process chamber that processes the substrate from a vibration sensor while executing the process recipe; and (b) detecting presence of an abnormality sign in a case where a ratio between a magnitude of vibration at a rotation frequency of the member and a magnitude of vibration at a comparison frequency that is an integral multiple of the rotation frequency exceeds a preset abnormality sign threshold on the basis of the acquired vibration data.
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