SYSTEMS AND METHODS FOR PREDICTING LAYER DEFORMATION

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United States of America Patent

APP PUB NO 20230222273A1
SERIAL NO

18118657

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Abstract

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A method involving obtaining a resist deformation model for simulating a deformation process of a pattern in resist, the resist deformation model being a fluid dynamics model configured to simulate an intrafluid force acting on the resist, performing, using the resist deformation model, a computer simulation of the deformation process to obtain a deformation of the developed resist pattern for an input pattern to the resist deformation model, and producing electronic data representing the deformation of the developed resist pattern for the input pattern.

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Patent OwnerAddress
ASML NETHERLANDS B VDE RUN 6501 VELDHOVEN NL-5504 DR

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BATISTAKIS, Chrysostomos Eindhoven, NL 11 7
Middlebrooks, Scott Anderson Duizel, NL 65 521
Wuister, Sander Frederik Eindhoven, NL 98 1240

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