CURING AGENT, ADHESIVE COMPOSITION FOR SEMICONDUCTOR COMPRISING SAME, ADHESIVE FILM FOR SEMICONDUCTOR, AND SEMICONDUCTOR PACKAGE USING SAME
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United States of America Patent
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Issued Date -
Jul 13, 2023
app pub date -
Apr 16, 2021
filing date -
Apr 24, 2020
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Abstract
The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive strength and having excellent reliability because of being inhibited from cracking, an adhesive film for a semiconductor device, and a semiconductor package including the same.
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