ELECTROTHERMAL FILM STRUCTURE, ELECTROTHERMAL FILM HEATING DEVICE AND METHOD FOR MANUFACTURING ELECTROTHERMAL FILM
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United States of America Patent
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Issued Date -
Jul 6, 2023
app pub date -
Nov 18, 2022
filing date -
Dec 31, 2021
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Abstract
Disclosed are an electrothermal film structure, an electrothermal film heating device and a method for manufacturing an electrothermal film. The electrothermal film structure includes a supporting layer, a meshed conductive circuit layer and a transparent optical layer. The meshed conductive circuit layer provided on the supporting layer includes several micron-level conductive circuits distributed in a mesh, and the transparent optical layer is provided on the meshed conductive circuit layer.
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