Transfer System and Transfer Method
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United States of America Patent
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Issued Date -
Jul 6, 2023
app pub date -
Sep 21, 2020
filing date -
Sep 21, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
Provide are a transfer system and a transfer method. The transfer system is configured to transfer chips and includes a temporary substrate and a transfer device. The temporary substrate has a first surface and a second surface opposite to each other. There is a first angle between the second surface and the first surface. The transfer device has a transfer substrate and a plurality of transfer heads provided on the transfer substrate. The transfer substrate has a third surface and a fourth surface opposite to each other, and there is a second angle between the fourth surface and the third surface. The plurality of transfer heads are located at intervals on the fourth surface, and a side surface of the above-mentioned transfer head that faces away from the transfer substrate is parallel to the fourth surface.
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