Optical Module Including Metasurface Chip and Methods of Manfuacturing Thereof
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United States of America Patent
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Issued Date -
Jul 6, 2023
app pub date -
Dec 30, 2022
filing date -
Dec 30, 2021
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Abstract
Disclosed herein is metasurface modules configured to reduce the cost of integration of metasurface elements within a housing and methods of manufacturing thereof. One particular embodiment includes a metasurface module including: a secondary substrate; and a metasurface chip mounted on the secondary substrate. The secondary substrate laterally extends from all sides of the metasurface chip to completely surround the metasurface chip. The secondary substrate may be utilized to mount the metasurface chip within a housing which decreases the size of the metasurface chip and ultimately decreases manufacturing costs of the metasurface chip.
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