INDIUM COMPOUND, METHOD OF PRODUCING THE SAME, COMPOSITION FOR DEPOSITING INDIUM-CONTAINING THIN FILM, AND INDIUM-CONTAINING THIN FILM
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United States of America Patent
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Issued Date -
Jul 6, 2023
app pub date -
Dec 27, 2022
filing date -
Dec 30, 2021
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Provided are an indium compound, a method of producing the same, a composition for depositing an indium-containing thin film including the same, and a method of producing an indium-containing thin film using the same. The provided indium compound has excellent thermal stability, high volatility, and improved vapor pressure, thereby producing an indium-containing thin film having a uniform thickness with an improved deposition speed by adopting the indium compound.
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