METHOD AND APPARATUS FOR FILLING A GAP

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United States of America Patent

APP PUB NO 20230207309A1
SERIAL NO

18117729

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to the invention there is provided a method of filling one or more gaps created during manufacturing of a feature on a substrate by providing a deposition method comprising; introducing a first reactant to the substrate with a first dose, thereby forming no more than about one monolayer by the first reactant; introducing a second reactant to the substrate with a second dose. The first reactant is introduced with a sub saturating first dose reaching only a top area of the surface of the one or more gaps and the second reactant is introduced with a saturating second dose reaching a bottom area of the surface of the one or more gaps. A third reactant may be provided to the substrate in the reaction chamber with a third dose, the third reactant reacting with at least one of the first and second reactant.

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Patent Owner(s)

Patent OwnerAddress
ASM IP HOLDING B VALMERE

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukazawa, Atsuki Tama-shi, JP 98 37777
Fukuda, Hideaki Hachioji-shi, JP 95 22316
Haukka, Suvi Helsinki, FI 94 21518
Jongbloed, Bert Oud-Heverlee, BE 58 6646
Knaepen, Werner Leuven, BE 45 6955
Pierreux, Dieter Dilbeek, BE 71 7645
Pore, Viljami Helsinki, FI 83 9315
Van, Aerde Steven RA Tielt-Winge, BE 11 682

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