METHOD FOR FABRICATING A MICRO RESISTANCE LAYER AND METHOD FOR FABRICATING A MICRO RESISTOR

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United States of America Patent

APP PUB NO 20230207164A1
SERIAL NO

17654818

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for fabricating a micro resistance layer and a method for fabricating a micro resistor are provided. The method for fabricating a micro resistance layer includes: providing a substrate; forming a first resistance layer on the substrate by using a screen printing process or a sputtering process; dividing the first resistance layer into second resistance layers, wherein each one of the product regions includes a second resistance layer, and an area of each one of the product regions is smaller than 0.4*0.2 mm2; and trimming the second resistance layer of each one of the product regions according to a predetermined resistance value to enable the pattern of each one of the second resistance layers to correspond to the predetermined resistance value. The method for fabricating a micro resistor uses the method for fabricating a micro resistance layer for fabrication of the micro resistor.

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Patent Owner(s)

Patent OwnerAddress
YAGEO CORPORATIONNO 16 WEST 3RD ST N E P Z KAOHSIUNG CITY 811

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHI, Chih-Wei Kaohsiung City, TW 5 17
HSIAO, Shen-Li KAOHSIUNG CITY, TW 28 18

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