RESIN MOLDING APPARATUS, COVER PLATE, AND RESIN MOLDED ARTICLE PRODUCTION METHOD
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United States of America Patent
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Issued Date -
Jun 29, 2023
app pub date -
Apr 28, 2021
filing date -
May 25, 2020
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention is intended to prevent resin from sticking to a molding surface of a first molding die that holds an object to be molded, without using a release film, and is a resin molding apparatus that performs resin molding on the object to be molded, the resin molding apparatus including: a first molding die that holds the object to be molded; a second molding die that is provided in a manner facing the first molding die and that has a cavity for holding resin material; and a cover plate that is provided between the object to be molded and the first molding die, that covers a molding surface of the first molding die, and that has rigidity for maintaining its own shape.
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