SOLDER GRID ARRAY FOR ATTACHMENT OF A DIE PACKAGE
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
Dec 20, 2021
filing date -
Dec 20, 2021
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Abstract
A die package comprises a substrate comprising a solder pad element, a semiconductor die coupled to the substrate, a solder layer comprising a first solder material deposited on the solder pad element, the first solder material having a first melting temperature, and an interconnect ball comprising a second solder material deposited on the solder layer, the second solder material having a second melting temperature that is less than the first melting temperature.
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