RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND ASSOCIATED FABRICATION METHODS
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
Dec 20, 2021
filing date -
Dec 20, 2021
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Abstract
Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.
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