MODULAR GROUND ENGAGEMENT TOOLING SYSTEM
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
Jul 25, 2022
filing date -
Nov 18, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A tooling system includes a dipper having a lip with a plurality of apertures, the apertures extending at least partially through the lip. The tooling system also includes a modular adapter configured to be inserted partially into one of the apertures along an axis of insertion. The adapter is configured to be releasably coupled to the lip. The adapter includes a first portion configured to extend into the aperture, and a second portion configured to extend out of the aperture. The tooling system also includes a locking system including a fastener configured to extend at least partially into the aperture and couple to the adapter to the lip.
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