APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
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United States of America Patent
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Issued Date -
Jun 22, 2023
app pub date -
Sep 15, 2022
filing date -
Dec 17, 2021
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Abstract
An apparatus for processing a substrate is provided. The apparatus includes: a levitation stage transferring a substrate in a first direction and including first areas and second areas, which are arranged in a second direction that is different from the first direction; a plurality of rollers installed in the first areas and transferring the substrate; a plurality of first vacuum holes installed in the first areas and sucking the air at first pressure; and a plurality of second vacuum holes installed in the second areas and sucking the air at second pressure that is different from the first pressure.
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