SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
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United States of America Patent
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Issued Date -
Jun 15, 2023
app pub date -
Sep 30, 2022
filing date -
Dec 15, 2021
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Abstract
In one example, a semiconductor die comprises: a semiconductor substrate having a circuit formed therein; one or more metal layers on the semiconductor substrate, the one or more metal layers coupled to the circuit; a metal interface structure on the one or more metal layers, in which the metal interface structure has opposite first and second surfaces, and the first surface faces the one or more metal layers; and a dissolvable metal layer on the second surface.
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