SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Jun 15, 2023
app pub date -
Nov 17, 2022
filing date -
Dec 14, 2021
priority date (Note) -
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Abstract
In a method of manufacturing a semiconductor package, at least one conductive wire is formed on a substrate in a wire bonding process, a ball end of the conductive wire is located above the substrate, a molding material is provided to cover the conductive wire except the ball end, and an EMI shielding layer is formed on the molding material to connect to the ball end. Owing to the ball end is exposed on the molding material, connection area of the EMI shielding layer to the conductive wire is increased to improve connection strength and reliability between the EMI shielding layer and the conductive wire.
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