LAMINATED BODY AND LAMINATED BODY MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Jun 15, 2023
app pub date -
Feb 15, 2023
filing date -
May 18, 2021
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Abstract
Provided are a laminated body and a laminated body manufacturing method that can improve adhesiveness between a resin layer and a seed layer. The laminated body has a substrate, a first wiring layer, a resin layer, and a second wiring layer in this order, and the second wiring layer includes at least an adhesive layer and a seed layer in this order.
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