PARAMYLON-BASED RESIN, MOLDING MATERIAL, MOLDED BODY, AND PRODUCTION METHOD FOR PARAMYLON-BASED RESIN
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United States of America Patent
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Issued Date -
Jun 8, 2023
app pub date -
May 7, 2021
filing date -
May 8, 2020
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Abstract
A paramylon-based resin excellent in mechanical characteristics and thermoplasticity is provided. The present embodiment provides a paramylon-based resin in which hydrogen atoms of hydroxy groups of paramylon are substituted by linear saturated aliphatic acyl group having 14 or more carbon atoms as a long chain component and/or acyl group having 2 or 3 carbon atoms (acetyl group or/and propionyl group) as a short chain component, wherein the paramylon has a weight average molecular weight in the range of more than 140000 to 220000 and a molecular weight distribution (weight average molecular weight/number average molecular weight) of 6.5 or less, a protein content of the paramylon is 0.22% by mass to 5.0% by mass, and a degree of substitution (DSLo) by the long chain component and a degree of substitution (DSSh) by the short chain component satisfy the following expressions (S1), (L1) and (T1); 1.7≤DSSh≤2.8 (S1), 0≤DSLo≤0.4 (L1), 2.1≤DSLo+DSSh≤2.8 (T1).
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