Importance

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Abstract

Disclosed according to an embodiment is a communications module comprising: a first substrate having a first hole formed herein; a communications unit including a second substrate and a plurality of elements disposed on one side of the second substrate; and a heat sink disposed on the other side of the second substrate, wherein a peripheral region of the second substrate is disposed so as to vertically overlap with the periphery of the first hole of the first substrate. Accordingly, the communications module can realize an optimized heat dissipation structure in which the communications unit and the heat sink are in contact with each other on the substrate by using a thermally conductive member as a medium.

First Claim