CURED CONDUCTIVE BINDER MATERIAL, USES THEREOF AND METHODS OF FORMING SAME
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United States of America Patent
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Jun 1, 2023
app pub date -
Apr 8, 2021
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Apr 8, 2020
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Abstract
The present invention relates to a method of forming a cured conductive binder material, to a method of forming a curable binder formulation, to a curable binder formulation, to a cured conductive binder material and to an electrochemical cell. In one embodiment, the method of forming a cured conductive binder material includes the steps of: (i) providing a liquid formulation comprising a liquid carrier, at least one active material, at least one polymeric binder and at least one modified metal coordination complex; and (ii) curing the liquid formulation of step (i), to thereby form a cured conductive binder material.
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