DIAMOND COMPOSITE AND METHOD OF MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20230170276A1
SERIAL NO

17927608

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Abstract

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This diamond composite includes a first base substrate which has an oxide layer of element M and contains the element M in the composition and a second base substrate which is bonded to the oxide layer and is composed of diamond, in which the M is one or more selected from a metal element with which an oxide can be formed, Si, Ge, As, Se, Sb, Te, and Bi, and the second base substrate is bonded to the oxide layer of the first base substrate by M-O—C bonding of at least some C atoms on the surface of the diamond constituting the second base substrate.

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Patent Owner(s)

Patent OwnerAddress
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY3-1 KASUMIGASEKI 1-CHOME CHIYODA-KU TOKYO 1008921 ?1008921

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KURASHIMA, Yuuichi Tsukuba-shi, Ibaraki, JP 9 24
MATSUMAE, Takashi Tsukuba-shi, Ibaraki, JP 5 0
TAKAGI, Hideki Tsukuba-shi, Ibaraki, JP 35 388
UMEZAWA, Hitoshi Ikeda-shi, Osaka, JP 17 111

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