Method of wafer alignment using at resolution metrology on product features

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 12124179
APP PUB NO 20230168594A1
SERIAL NO

17920014

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Abstract

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A method of determining a position of a product feature on a substrate, the method includes: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are referenced to either a positioning system used in displacing the substrate in between measurements or a plane parallel to the surface of the substrate; and determining a distortion component of the substrate based on the position measurements.

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Patent Owner(s)

  • ASML NETHERLANDS B.V.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dillen, Hermanus Adrianus Veldhoven, NL 19 21
Kea, Marc Jurian Morgan Hill, US 11 42
Kou, Weitian Eindhoven, NL 14 39
Tel, Wim Tjibbo Veldhoven, NL 78 537
Werkman, Roy Eindhoven, NL 35 143

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