Methods of determining corrections for a patterning process, device manufacturing method, control system for a lithographic apparatus and lithographic apparatus

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United States of America Patent

PATENT NO 11782349
APP PUB NO 20230168591A1
SERIAL NO

18100662

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Abstract

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A method of determining a correction for a process parameter related to a lithographic process, wherein the lithographic process includes a plurality of runs during each one of which a pattern is applied to one or more substrates. The method of determining includes obtaining pre-exposure metrology data describing a property of a substrate; obtaining post-exposure metrology data comprising one or more measurements of the process parameter having been performed on one or more previously exposed substrates; assigning, based on the pre-exposure metrology data, a group membership status from one or more groups to the substrate; and determining the correction for the process parameter based on the group membership status and the post-exposure metrology data.

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Patent Owner(s)

Patent OwnerAddress
ASML NETHERLANDS B VP O BOX 324 VELDHOVEN 5500 AH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cekli, Hakki Ergün Singapore, SG 30 101
Deckers, David Frans Simon Turnhout, BE 12 58
Delvigne, Erik Henri Adriaan Breda, NL 6 5
Dovbush, Iryna Eindhoven, NL 4 5
Giollo, Manuel Eindhoven, NL 4 5
Grouwstra, Cédric Désiré Eindhoven, NL 19 55
Hauptmann, Marc Turnhout, BE 22 93
Kou, Weitian Eindhoven, NL 14 39
Kupers, Michiel Roermond, NL 13 79
Roelofs, Willem Seine Christian Deurne, NL 12 37
Van, Der Sanden Stefan Cornelis Theodorus Nijmegen, NL 14 132
Vergaij-Huizer, Lydia Marianna Eindhoven, NL 7 10
Wallerbos, Erik Johannes Maria Helmond, NL 15 43
Ypma, Alexander Veldhoven, NL 42 558

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